About
JE CUBE, a Korean Headquartered company, with branch office in the United States, has experience and innovative technology for OVEN, PLASMA, reliability test equipment, and industrial equipment for semiconductor production.
We have been established to provide customized products that reduce production cost and increase production reliability.
Production of Oven (Clean, Vacuum, Pressure, High Temp. Hot Plate) and Plasma (Vacuum, Atmospheric), which are semiconductor production process equipment, customizing development is possible according to customer needs, and we have in-line automation products and technologies specialized for production processes.
JE CUBE aims to develop the products for the fourth industrial revolution. “Technology is inspiration”, is how we feel.
In summary we are an equipment manufacturer with differentiated quality competitiveness by combining current and future technologies.
We are also partnered with other quality manufacturers that are specialized in EHS solutions and safety storage.
Pressure Oven
Pressure oven is a facility that gives constant pressure and temperature. It removes voids when hardening epoxy or underfill solution, and is also used in film bonding process.
Key Feature
- Temperature : Max. 220°C
- Temperature Accuracy : +/ 0.3°C
- Temperature Uniformity : +/ 3 at 175°C
- Max. Pressure : 10 cm2
- Pressure Stability : Within 0.1Kg/ cm2
- High Productivity
- PM Calibration Point : Multi points temp
- Stainless Steel Chamber
- Multi Safety Device for Temperature and Pressure
Clean Oven
Clean oven is an equipment that cures under clean working conditions. Even though Hepa filter is applied, it has excellent temperature uniformity due to its characteristics of good wind circulation.
Key Feature
- Temperature : Max. 250°C (Optional 450°C)
- Temperature Accuracy : +/ 0.3°C
- Temperature Uniformity : +/ 3 at 175°C
- Cleanness
- USA : Fad. Standard 209E Class100 or Class10
- international : ISO 14644-1 Class5 or Class4
- Filter : HEPA or ULPA
- N2 purge
- Cooling Type : Air/Water Cooling
- Air Flow Type : Horizontal Laminar Flow
- Main Computer can Control and Monitor all of Oven Operation Status (SECS/GEM)
Cure Oven
Cure ovens are equipment that cures under normal conditions and are widely used in semiconductors and various fields.
Key Feature
- Temperature : Max. 250°C
- Temperature Accuracy : +/ 0.3°C
- Temperature Uniformity : +/ 3 at 175°C
- Minimize Floor Space with Slim Structure
- Shorten Cycle Time with Multiple Loading
- Operate Flexible Programming & Independent Cure for Each Chamber
- Wireless Networking System
- Multi step Curing Process Capability
- High Quality Temperature Control
- High Stability Curing Temperature
- Smart & User Friendly Design
Vacuum Oven
Vacuum oven is an equipment that cures using radiant heat in a vacuum state in a chamber and is widely used in the moisture removal process.
Key Feature
- Temperature : Max. 200°C
- Temperature Accuracy : +/ 0.5°C
- Temperature Uniformity : +/ 7 at 125°C
- Cooling : Water, N2, Air type
- Max. Vacuum Degree : 0.1torr
- Easy to Run Device and to Manage Data by its Exclusive Software
- Sample Protection by Overheating Prevention System
- Automatic Door Lock System
- Complete Isolation for Improvement on Vacuum Sustainability
- Reducing Cycle Time by Individual Chamber Loading System
- Temperature Control and Multistep Cure by Control Panel
Cone Type Vacuum Oven
It is a device for drying the powdery material inside by rotating the cone type vacuum chamber by applying conductive heat evenly.
Key Feature
- Temperature : Max. 180°C
- Heating Source : Steam
- Cooling : Water, N2, Air type
- Easy to Run Device and to Manage Data by its Exclusive Software
- Sample Protection by Overheating Prevention System
- Automatic Door Lock System
- Complete Isolation for Improvement on Vacuum Sustainability
- Reducing Cycle Time by Individual Chamber Loading System
- Temperature Control and Multistep Cure by Control Panel
High Temperature Oven
High temperature ovens are equipment that harden wafers using high temperature conditions and are widely used in semiconductor bumping processes.
Key Feature
- Temperature : Max. 450°C
- Temperature Accuracy : +/ 0.5°C
- Temperature Uniformity : +/ 3 at 375°C
- Cooling : Water Cooling
- Oxygen Monitoring : O2 Analyzer 100ppm below (Optional)
- Easy to Run Device and to Manage Data by its Exclusive Software
- Sample Protection by Overheating Prevention System
- Automatic Door Lock System
- Temperature Control and Multistep Cure by Control Panel
Automation In-line Oven (Clean)
High temperature ovens are equipment that harden wafers using high temperature conditions and are widely used in semiconductor bumping processes.
Key Feature
- Temperature : Max. 250°C
- Temperature Accuracy : +/ 0.3°C
- Temperature Uniformity : +/ 3 at 175°C
- Filter : HEPA or ULPA
- Cooling Type : Air/Water Cooling
- Capability
- Tact time : 72sec (127.5ea/153min)
- Cure : 153min (R/U:33min, Cure:90min, Cooling:30min)
- 72 Carrier X 4 chamber = 288 Carrier
- Control : PC Based
Atmospheric Plasma
Atmospheric plasma is a facility used to improve adhesion quality by cleaning the surface of flat products such as semiconductors, displays, films, and touch panels.
Key Feature
- Plasma Module: Max. 2,500mm
- Power Source: RF, MF, LF, DC
- Process Gap: Min. 2 ~ Max. 7mm
- Gas Utility: Ar , O2, N2,
- Speed: 10mm/s ~ 100mm/s
- Handler: Auto or Manual
UV Cure
UV curing machine is used for curing and coating printing of products such as semiconductors, displays, films, and touch panels. It is also used for the purpose of reliable tape removal for wafer dicing tape remover.
Key Feature
- UV Lamp: High Pressure Mercury Type
- UV Dose: 50 ~ ㎠ (customized)
- Scanning : Speed Adjustable
- Loading / Unloading Type: Drawer Type (slide)
- Monitoring : UV Lamp Integrated with Usage Time
- Exhaust : Hot air & Gas
- N2 Purge System
WLFO Hot-plate Oven
UV curing machine is used for curing and coating printing of products such as semiconductors, displays, films, and touch panels. It is also used for the purpose of reliable tape removal for wafer dicing tape remover.
Key Feature
- Temperature : Max. 280°C
- Temperature Accuracy : +/ 0.1°C
- Temperature Uniformity : +/ 1.25 at 230°C
- Wafer Loading : 8” & 12”
- Sensor Array 12 point Tested
- Ramp up time : R.T to 250°C within 25min
- (Temp. Rise : 10’C/min)
- Cooling Type : Water Cooling
- O2 Analyzer : 30ppm (within 15min)
- Flatness : Max. 300 μ m (at. 280’C)